11 月 29 日消息，華為技術有限公司在近日公開了“芯片封(feng)裝(zhuang)組件(jian)、電子設備及芯片封(feng)裝(zhuang)組件(jian)的制作方法”專利，公開號為(wei) CN113707623A。
企查查專利摘要(yao)顯示，本申(shen)請公開(kai)了一種芯(xin)片封(feng)裝組(zu)件、電(dian)子設備及芯(xin)片封(feng)裝組(zu)件的制作(zuo)方法。
芯(xin)片(pian)(pian)封(feng)裝(zhuang)組件包(bao)括封(feng)裝(zhuang)基板(ban)、芯(xin)片(pian)(pian)和(he)散熱(re)(re)部(bu)，封(feng)裝(zhuang)基板(ban)包(bao)括上導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)、下(xia)導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)和(he)連接(jie)在(zai)上導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)和(he)下(xia)導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)之間的(de)導(dao)(dao)(dao)電(dian)(dian)(dian)部(bu)；芯(xin)片(pian)(pian)包(bao)括相背設置的(de)正面(mian)電(dian)(dian)(dian)極(ji)和(he)背面(mian)電(dian)(dian)(dian)極(ji)，芯(xin)片(pian)(pian)內(nei)(nei)嵌在(zai)封(feng)裝(zhuang)基板(ban)內(nei)(nei)，導(dao)(dao)(dao)電(dian)(dian)(dian)部(bu)包(bao)圍芯(xin)片(pian)(pian)，正面(mian)電(dian)(dian)(dian)極(ji)與下(xia)導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)連接(jie)，背面(mian)電(dian)(dian)(dian)極(ji)與上導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)連接(jie)；散熱(re)(re)部(bu)連接(jie)于上導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)遠離芯(xin)片(pian)(pian)的(de)表面(mian)；上導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)、下(xia)導(dao)(dao)(dao)電(dian)(dian)(dian)層(ceng)(ceng)和(he)導(dao)(dao)(dao)電(dian)(dian)(dian)部(bu)均具導(dao)(dao)(dao)熱(re)(re)性能。
本申請通過設置芯片與封裝基板的上導電層以及下導電層連接，從(cong)而(er)芯(xin)片(pian)產生的熱(re)量可進行雙向傳導(dao)散熱(re)，并在上導(dao)電層上設置散熱(re)部，使得芯(xin)片(pian)封(feng)裝(zhuang)組件能夠達到更優的散熱(re)效果(guo)。
IT之家了解到，當前，電子設備越來越輕薄，芯片封裝組件的集成度越來越高，存在著較為嚴重的散熱問題，芯片(pian)無法得到有效散熱的話，會有一定(ding)的安全隱患，華為這項專(zhuan)利可以較好的解決部分散熱問(wen)題。
資訊來源：IT之家
